摘要
精碲生产中由于某些因素的影响,电解过程中发生副反应使阳极产生阳极泥、阴极板上出现粒子。为了优化电解过程、抑制阴极板上粒子的生长,进行了一系列的探索实验,考查了还原剂、电解质组分、温度和阳极板结构对于电解过程的影响。结果表明调节合适温度和改变阳极板结构都能够较有效地抑制阴极板上粒子的生长。
Due to some influenced factors in pure tellurium production, side reaction could generate anode slime, and some particles happened on the surface of cathode plate during electrode process. In order to optimize the electrolytic process, restrain the growth of particles on the cathode plate, a series of exploring experiments were implemented,examine electrolytic process influence caused by the reducing agent, electrolyte composition, temperature and anode plate structure. The results showed that appropriate temperature and change anode plate structure could effectively inhibit the particles growth on the cathode plate.
出处
《铜业工程》
CAS
2016年第3期73-75,86,共4页
Copper Engineering
关键词
电解
碲阳极泥
添加剂
粒子
温度
碲
阳极板
electrolytic
tellurium anode slime
additive
particles
temperature
tellurium
anode plate