期刊文献+

添加微量Ce对BiCuSn系高温无铅焊料焊接性能的影响 被引量:2

Effect of Ce addition on soldering property of BiCuSn system high temperature lead-free solder
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摘要 通过向Bi-2Cu-1Sn系钎料合金中添加微量稀土Ce,研究稀土元素Ce添加量对Bi-2Cu-1Sn钎料合金的熔点、润湿性、力学性能以及显微组织的影响.结果表明:添加适量的Ce可明显改善Bi-2Cu-1Sn合金的润湿性和焊接强度.当添加Ce质量分数为0.3%时,钎料合金熔点为最低267.6℃,润湿面积增加26%,润湿角达到最小41°,焊接剪切强度达到最大19.6 MPa,此时焊料合金的综合性能最佳. The influence of rare earth element Ce on melting temperature,wetting properties,mechanical properties and microstructure of Bi-2Cu-1Sn solder has been studied.The results shows that,the doping suitable amount of Ce can improve wetting properties and mechanical properties of Bi-2Cu-1Sn,when the addition of 0.3wt% Ce,the melting point of the solder alloy is 267.6℃,the spreading area is increased by26%,the shear strength is 19.6 MPa,respectively.The solder alloy Bi-2Cu-1Sn-0.3Ce has a superior comprehensive properties at aforementioned parameters.
出处 《材料研究与应用》 CAS 2016年第2期106-110,共5页 Materials Research and Application
基金 高等学校博士学科点专项科研基金(20124420110007) 广东省联合培养研究生示范基地人才培养项目(2013JDXM27)
关键词 高温无铅焊料 熔点 润湿性 剪切强度 IMC high-temperature lead-free solder melting point wetting properties shear strength IMC
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参考文献7

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二级参考文献55

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