菌丝体/膨胀珍珠岩建筑用保温隔热复合材料实验研究

The Experimental Study of Mycelium/Expanded Perlite Thermal Insulation Composite Material for Buildings

选用不同片径的蘑菇菌丝体,分别以水玻璃、聚乙烯醇为黏结剂进行粘结,以模压成型工艺制备两种黏结剂下的纯菌丝板,对其进行热学和力学性能测试,确定最佳导热系数的菌丝片径大小为6~8目;以具有最佳导热系数片径的蘑菇菌丝与膨胀珍珠岩混合,以相同的工艺方法制备两种黏结剂下的菌丝体/膨胀珍珠岩复合保温材料,研究材料的密度、导热系数、抗折、抗压强度和膨胀珍珠岩所占比例（ω）之间的关系。结果表明：随着ω的增加,材料的密度、抗折、抗压强度逐渐降低,两种黏结剂相比,以水玻璃粘结的材料具有更小的密度、抗折、抗压强度;导热系数随着ω增加出现降低的趋势,且以水玻璃粘结的样品具有更小的导热系数,更适合于建筑隔热保温材料的应用。

Firstly,different diameter of the mushroom mycelium was choosed to get the pure hyphae plate( PHP),which were bonded with sodium silicate and polyvinyl alcohol respectively in the method of mould pressing craft. Then by thermal and mechanical properties test,the optimum thermal conductivity( λ) of the mycelium diameter size was determined,which is 6 ~ 8 mesh,the kind of mycelium were mixed with expanded perlite,in the same method mycelium / expanded perlite thermal insulation composite material( MPM) were made with the same binder. The relationship between the density of MPM,λ,the flexural strength,compressive strength and the mass ratio of expanded perlite to the total quality of mycelium and expanded perlite( ω) were investigated. The results indicate that with the increase of ω,material density,flexural strength,compressive strength gradually decrease,compared with the binder of silicate and polyvinyl alcohol,the material with sodium silicate binder have smaller density,flexural strength,compressive strength and λ.