摘要
鉴于晶片电子封装结构的一些精细电磁现象如复杂互连结构的不连续性、寄生效应带来的信号完整性等问题,采用电磁分析软件CST微波工作室,建立了封装与PCB复杂互连结构的物理模型,对信号传输性能进行仿真分析,并对简单等效电路模型进行改进。结果表明:增大焊球半径,采用低介电常数基板材料,可提高互连结构的信号传输效率。采用软件ADS模拟电路模型,其结果与软件CST的结果趋势基本吻合。
In view of fine electromagnetic phenomenon of chip electronic packaging structure, such as discontinuity of complex interconnection structure and signal integrity generated by parasitic effect, the complex interconnection structure physical model of encapsulation and PCB was built by using electromagnetic analysis software CST microwave suit. Signal transmission performance was simulated and analyzed. Then the simple equivalent circuit was improved. The results show that the signal transmission efficiency of interconnection structure is increased by magnifying the ball radius and using substrate material with low ？r value. Finally, the result obtained by software ADS basically coincides with the result by CST.
出处
《电子元件与材料》
CAS
CSCD
2016年第8期81-85,共5页
Electronic Components And Materials
基金
河北省高等学校高层次人才科学研究项目资助(No.GCC2014011)
关键词
传输特性
电子封装
互连结构
CST
等效电路
ADS
transmission performance
electronic package
interconnect structure
CST
equivalent circuit
ADS
