浅析SMT焊接质量的主要影响因素和改善措施

SMT soldering quality is analysed the main influence factors and improving measures

SMT工艺作为电子组装的核心工艺,其焊接质量的好坏直接影响产品的整体质量和生产成本,因此,改善SMT焊接质量,减少客户投诉,能提高公司产品的竞争力。本文结合自己多年的SMT生产实践经验,简要的从物料、PCB焊盘设计、锡膏印刷、元件贴装、回流焊接等方面对SMT焊接质量的影响,并提出相应的预防和改善措施。

SMT process as the core of the electronics assembly process, the welding quality directly affects the overall quality of the products and the production cost, therefore, to improve the SMT welding quality, reduce customer complaints, improve the competitiveness of the company＇s products. In this paper, the author combines his years of SMT production experience, briefly from material, PCB plate design, solder paste printing, component mount, reflow soldering and other aspects of SMT Soldering Quality influence, and puts forward corresponding measures to prevent and improve.