B含量对IC10合金TLP焊接用中间层材料及接头组织的影响

Influence of boron-addition on microstructure of interlayer alloys and TLP bonded IC10 superalloy joints

以母材成分为基、以硼为降熔元素配制了3种中间层材料,并对中间层和焊缝的组织进行了研究。结果表明,在B含量为1.6%-3.2%范围内,随着B含量的增加,中间层材料中硼化物数量增多,组织细化,均匀性提高。1 270℃保温1 h的对接接头组织观察表明,中间层材料的B含量越高,焊缝中心共晶区宽度越小,共晶区硼化物断续分布,数量减少,焊缝中γ＇相的数量增多,尺寸增大。

Three interlayer alloys were prepared by adding boron to the base metal as a melting point depressant. The microstructures of these intermediate layers were investigated. An increase in boron content( range 1. 6% ~ 3. 2%) contributes to the precipitation of boride and the evenness of the microstructure. TLP bonding experiments were carried out at 1 270 ℃ for an hour. The results show that as the boron content in the intermediate layer increases,the width of the eutectic region in the centerline of the joints significantly decreases. Borides precipitated on the crown of γ + γ' eutectics exhibit a non-sequential distribution as well as a decrease in quantity. Meanwhile,γ' phases in the joint region are growing in numbers,coarsening in shape and expanding in size.