摘要
基于近20年的研发,宽禁带半导体材料碳化硅(SiC)的金属-氧化物-半导体场效应晶体管(MOSFETs)的制备工艺逐步成熟,性能不断提高,已有SiC MOSFETs产品进入市场,故综述双注入MOSFETs(DMOSFETs)和沟槽MOSFETs(UMOSFETs)两种结构的SiC MOSFETs的研究进展和发展趋势,并介绍SiC MOSFETs器件制备的关键工艺和目前推出SiC MOSFET产品的公司及其产品性能。
The silicon carbide metal-oxide-semiconductor field-effect transistors (SiC MOSFETs) have been developing for twenty years, and their processing technologies and properties are im- proved gradually. Nowadays, some products of this kind have entered the market. The progress of SiC Double-implanted MOSFETs (DMOSTETs) and Trench MOSFETs (UMOSFETs) is re- viewed. Meanwhile, the devices' key proeessing techniques and the performance of SiC MOS- FETs products are also introduced.
出处
《西安邮电大学学报》
2016年第4期1-8,共8页
Journal of Xi’an University of Posts and Telecommunications
基金
国家自然科学基金重点项目(61334002)