摘要
在数字阵列雷达系统发展过程中,数字T/R组件设计一直是研究的重点。传统的数字T/R组件设计方法大都是微波和数字独立设计,无法进一步提高雷达系统集成度。针对这一问题,论述了一种基于微系统封装技术的雷达数字T/R组件设计方法,在自主设计的微波及数字芯片基础上,通过仿真建模分析,将低噪声接收、收发变频、模数/数模转换、数字下变频,以及直接数字频率合成等功能集成在一个系统封装上,形成了一个单片雷达数字化收发系统芯片。经测试,该雷达数字化收发系统芯片性能指标满足数字阵列雷达系统要求,研究成果已在某数字阵列雷达试验系统中成功应用。
In digital array radar system development process,digital T/R module design is very important.In traditional digital T/R design method,microwave circuit and digital circuit are always independently designed.This method limits the radar integration level.To solve this problem,we discuss a radar digital T/R design method based on microsystems packaging.On the basis of autonomous-designed microwave and digital chips,through modeling and simulation analysis,we integrate LNA,MIX,ADC,DAC,DDC,and DDS into a microsystems packaging,a radar receive-transmit system chip achieved.After test,the performance indexes of the radar receive-transmitter system chip satisfy the needs of digital array radar.The research achivement already has been used in a digital array radar.
出处
《雷达科学与技术》
北大核心
2016年第3期317-323,共7页
Radar Science and Technology
关键词
雷达收发系统
数字阵列雷达
微系统封装
数字T/R
radar receive-transmit system
digital array radar
microsystems packaging
digital T/R