基于Moldflow软件对塑壳断路器盖板翘曲变形的研究

Research on the Warpage of Cover Plate of MCCB Based on Moldflow

为解决塑壳断路器盖板在注塑成型过程中常发生的翘曲变形的问题,利用Moldflow软件对盖板进行模拟,从充填、冷却和翘曲3个方面进行合理的分析,从而找出盖板翘曲变形的主要原因。再针对性地采取不同的优化方案对盖板的成型效果进行验证,分析不同的优化方案对盖板翘曲的变形量,从而确定最合理的方案以解决该类产品的缺陷问题。这为技术人员在解决类似盖板翘曲的问题上提供了一定的借鉴。

In order to solve the warpage and deformation of MCCB ＇ s cover plate occurred in the injectionmolding, this paper analyzed and simulated the cover plate from the filling, cooling and warping by using Moldflowsoftware to find out the main cause for the deformation. Accordingly, different optimization schemes were taken toverify the cover plate forming effect. A n d different optimization schemes were analyzed for deformation values todetermine the reasonable one to solve the defects for this type of product. This provides a certain reference fortechnic personnel to solve similar cover plate warpage problems.