单纯形优化法研究改良型全加成PCB的铜电镀液配方

Study on copper electroplating bath composition by simplex optimization for PCB made by modified full additive process

在铜基电镀液配方的基础上,运用单纯形优化法获得了适用于改良型全加成法制作印制电路板(PCB)工艺的优良铜电镀液配方:CuSO_4·5H_2O 71~84 g/L,硫酸96~108 mL/L,Cl^- 44~65 mg/L,加速剂0.5~0.9 mL/L,湿润剂13~20 mL/L。验证试验结果表明,采用该配方在铝板上进行电镀,所获得的铜镀层均匀、稳定,其镀层厚度的变异系数(COV)降至2.71%~4.39%,有利于改善全加成PCB产品的品质。

Based on the existing bath composition used for electroplating copper on copper substrate, an excellent copper electroplating bath composition for fabrication of printed circuit board （PCB） by modified full additive process was obtained using simplex optimization as follows： CuSO4·5H2O 71-84 g/L, H2SO4 96-108 mL/L, Cl^- 44-65 mg/L, accelerant 0.5-0.9 mL/L, and wetting agent 13-20 mL/L. The result of verification test showed that the copper coating on aluminum plate obtained from the given electroplating bath is uniform and stable. The coefficient of variation （COV） of coating thickness is decreased to 2.71%-4.39%, which is favorable for the improvement of PCB products made by full additive method.