铜基银镀层碱性电解退镀工艺

Electrolytic stripping of silver coating on copper substrate in alkaline solution

采用由250 m L/L LD-5930A、50 mL/L LD-5930B和36 g/L KOH组成的碱性退镀液对铜基镀银层进行电解退镀。研究了电流密度和温度对退镀效果和退镀速率的影响,得到最佳电流密度和温度分别为6 A/dm2和40°C。本工艺操作简单,退镀效率高,不会腐蚀纯铜基体或预镀纯铜零件,比浓酸退镀法更环保、安全。

Silver coating on copper substrate was electrolytically stripped in an alkaline bath composed of LD-5930A 250 mL/L, LD-5930B 50 mL/L and KOH 36 g/L. The optimal current density and temperature were obtained as 6 A/dm^2 and 40℃ respectively by studying their effects on stripping effectiveness and stripping rate. The given stripping process features simple operation and high stripping efficiency, has no corrosive effect on pure copper substrate or pure copper-preplated parts, and is more environment-friendly and safer than that using concentrated acid.