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影响密封继电器基座组合机械性能的主要因素

The Main Factors Influencing the Mechanical Properties of Sealed Relay Substrate Combination
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摘要 密封继电器基座组合的机械性能主要与接线脚的表面状态和预氧化有关,要获得牢固的气密封接件,就要对接线脚的表面状态、氧化膜厚度和结构进行控制。本文从接线脚的表面状态、预氧化的工艺方法、封接工艺参数等方面,对影响基座组合机械性能的主要因素进行了较详细的探讨。 The mechanical properties of the sealed relay substrate combination are mainly associated with the surface state and the preoxidation of the wiring feet. It is necessary to control the surface state,the oxide film thickness and structure of the wiring feet to obtain a tight gas seal. In this paper,the main factors of affecting the substrate composite mechanical properties are discussed in detail from the surface state of the wiring feet,the process method of the preoxidation,and the parameters of the sealing process,etc.
作者 王永 江晓波
出处 《机电元件》 2016年第4期61-64,共4页 Electromechanical Components
关键词 基座组合 机械性能 预氧化 封接工艺 表面状态 substrate combination mechanical property preoxidaton sealing process surface state
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