Ni电极MLCC电镀后端头锡层延伸问题研究分析

Research and Analysis of End Tin Layer Extension of Ni Electrode MLCC after Plating

随着Ni电极MLCC的不断发展,客户对MLCC芯片端头锡层延伸问题提出了新的要求。为了解决Ni电极MLCC在表面处理后出现的端头锡层延伸问题,研究了镀锡工艺中的电流及时间、电镀媒介装载比例以及电镀液成分对电镀后锡层延伸问题的影响。结果表明,选取合适的镀锡工艺曲线及电镀媒介装载比例,匹配相应的电镀液成分,可有效解决电镀后MLCC端头锡层延伸问题,获得到了客户的使用认证。

With the continuous development of Ni electrode MLCC, the end customers put forward the new requirements for MLCC chip tin layer extension problem. In order to solve the Ni electrode MLCC end tin layer extension problems after surface treatment, study the impact of current and time, medium load ratio and plating solution composition in the process of tin plating on tin layer extension after plating, the results show that the selecting the appropriate tin plating process curve and plating medium load ratio, matching the corresponding composition of plating solution, which can effectively solve the problem of MLCC end tin layer extension after plating, and finally obtained certification of the customer.