微波印制板材料对焊盘的影响

Effect of Microwave Printed Circuit Board Material on Pad

随着微波器件的微型化和集成化的快速发展,为了满足性能指标,对微波印制板材料的要求也越来越高,出现了许多特殊的微波基材,如铜基微带板和铝基微带板。由于这些微波板材的制造工艺技术较高,在实际使用中受环境因素和加工技术的影响,出现了许多性能问题。针对环境试验中模块出现的通道故障进行故障定位和原因分析,通过工艺试验和工艺分析的方法,从焊盘过孔中查找出铜基微波印制板材料的缺陷问题,对引起材料缺陷的原因进行了分析,并采用新材料解决故障。

With the rapid development of microwave device for miniaturization and integration, the requirements of microwave printed board material Is becoming increasingly higher, in order to meet the performance index. There have been many special microwave substrates, such as microstrip board based copper or aluminum. Due to the influence of environmental factors and processing technology, many performance problems have appeared in the practical application. the fault location and reason analysis of the channel failure in the environmental test are analyzed. The copper based microwave printed board material defects were found in via on pad by analyzing the process test and method. Analyses the reason of material defects, and new materials are used to solve the problem.