摘要
介绍了一种新颖的基于电子附着(Electron Attachment,EA)原理的氢气活化技术,可以实现在大气压力和正常焊接温度下的无助焊剂焊接。该技术有望被应用于电子封装行业的诸多领域。
A novel hydrogen activation technology based on electron attachment（EA） is developed for fluxless soldering at ambient pressure and normal soldering temperature.The technology has a potential to be used for a list of applications in the electronics packaging industry.
出处
《电子工业专用设备》
2016年第8期1-4,34,共5页
Equipment for Electronic Products Manufacturing
关键词
电子附着
活化氢
无助焊剂焊接
电子封装
氧化物去除
助焊剂残留
氢负离子
Electron attachment Activated hydrogen
Fluxless soldering
Electronics packaging
Oxide removal
Flux residues
Hydrogen anion
