摘要
在对碳化硅物理特性分析的基础上,对其多线切割的工艺技术进行了研究,总结出了在碳化硅多线切割设备的几个需要注意的技术要点;并在所研制的设备上进行了工艺切割试验,获得了较好的切割效果。
In this paper,based on the analysis physical character about SiC,and we introduce some research on its multi-wire saw cut,and get some key processing technology about the MWS.And we did some experiment about SiC cutting using this machine,and the surface quality about SiC wafer is good.
出处
《电子工业专用设备》
2016年第8期24-26,共3页
Equipment for Electronic Products Manufacturing
