ZnO/Cu多层膜的制备及电磁屏蔽性能研究

Preparation of ZnO/Cu multilayer films and study on the performance of electromagnetic shielding

采用磁控溅射法在涤纶水刺非织造布表面沉积纳米结构Cu单层膜和ZnO/Cu多层膜,利用原子力显微镜(AFM)对薄膜表面形貌进行分析,并利用四探针测试仪和矢量网络分析仪对样品的电学性能进行了测试。结果表明,在ZnO薄膜表面生长的Cu膜比在PET织物表面生长的Cu膜的均匀性、电学性能要好;在Cu镀膜时间相同的情况下,随着ZnO镀膜时间的增加,多层膜ZnO/Cu的电学性能先提高后降低,当ZnO镀膜时间为20min时,多层膜的电学性能达到最好;在ZnO镀膜时间相同的情况下,随着Cu镀膜时间的增加,多层膜ZnO/Cu的电学性能和织物表面颗粒均匀性经历了先提高、最后趋于稳定的过程,屏蔽效能最大平均值达到56dB。

Nanostructure copper single-layer film and ZnO/Cu multilayer films deposited on the surface of polyesterfiber spunlaced nonwovens by magnetron sputtering method. The surface morphology of thin film is analysedby Atomic Force MicroscopeC AFM）. The electrical properties of the sample is tested by four-probe testerand vector network analyzer. Experimental results show that the uniformity and electrical performance of thecopper film deposited on the ZnO thin film surface are better than coated on the PET fabric surface. With thesame copper deposition time and when the zinc oxide deposition time is increased？ the electrical performance ofmultilayer films ZnO/Cu increase and then decrease. When the zinc oxide deposition time is 20 min, the electricalperformance of multilayer films achieve the best one. With the same zinc oxide deposition time and whencopper deposition time is increased, the electrical performance and the uniformity of the particles on the surfacefabric of multilayer films of ZnO/Cu has experienced the process that first improve and finally tends to be stable.The maximum average shielding effectiveness has reached to 56 dB.