摘要
从高功率LED理论模型分析着手,分别从芯片级、封装级和系统级三个层面归纳和总结了LED热管理的最新研究进展。研究发现:芯片倒装结构及合理的阵列方式有利于散热;性能优良的封装材料和翅片的优化能有效降低热阻;选择适当的二次散热方式也是提高散热效率的关键。
Theoretical model of high-power LED was analyzed in this paper, in which the lat est research progress of its thermal management were studied and summarized from the chip lev el, package level and system level, respectively. It was found that flip-chip structure and reason able placements were conducive to heat dissipation; the thermal resistance could be effectively re duced with excellent packaging materials and optimized fin size ; choosing the appropriate second ary heat dissipation way was also the key to improve the heat dissipation efficiency.
出处
《光电子技术》
CAS
2016年第2期111-116,共6页
Optoelectronic Technology
基金
常州市自然科学基金资助(CJ20120024)
关键词
散热
高功率发光二极管
封装
热管理
heat dissipation
high-power LED
package
thermal management
