摘要
针对高功率、高封装和较大出光面积的UV-LED固化灯进行水冷散热,在保证较大出光功率的同时满足芯片对结温的要求。选用S形板管式水冷板对LED模块进行散热,运用CFD软件对冷板进行数值计算,得出各个芯片的温度分布及冷板内部的流动情况。根据得到的数值模拟结果对所设计的冷板在不同的工况下进行试验,得出LED模块结温及冷板综合换热性能,并对实验结果和数值模拟结果进行对比。经过多次试验发现所设计的冷板能够满足UV-LED的散热需求,并证明数值计算具有较高的可靠性。
The water cooling cold plate has been used as the heat design for UV-LED curing lamps with high power, high package intensity and large light area, in which the key point is to ensure the junction temperature of the LED modules in the limited range. An S-shaped cold plate was proposed for heat dissipation of LED modules. The temperature and flow distributions were simulated by the CFD software. According to the simulation results, a test module was investigated experimentally under vari- able operation conditions. The results of temperature and pressure drop obtained from the simulations and experiments were compared respectively. It could be concluded that the cold plate with water cooling could meet the needs of heat dissipation of UV-LED curing lamps. It is also found that the simulation re- sults have a good reliability for the heat design process.
出处
《光电子技术》
CAS
2016年第2期130-134,共5页
Optoelectronic Technology
关键词
紫外发光二极管固化灯
散热系统
冷板
实验测试
UV-LED curing lamps
heat dissipation system
cold plate
experimental tests
