处理电镀废水的耐铜功能菌的筛选及吸附性能

Isolation of Cu^(2+) tolerant bacteria used in electroplating wastewater treatment and their biosorption performance

针对表面加工工业园区来水量不定、水质复杂及物化预处理单元对重金属处理不完全,导致其污水处理厂的生物处理单元受到重金属影响的问题,以电镀废水中常见的Cu^(2+)为研究对象,从电镀废水活性污泥中分离得到两株对铜离子耐受能力较强的菌株,分别命名为L2和L3.考察吸附时间、p H、温度和初始Cu^(2+)质量浓度对耐铜功能菌吸附去除Cu^(2+)的影响.结果表明,在LB培养基和电镀废水培养基中,L2和L3均有较高的Cu^(2+)最小抑制浓度,且可在短时间内实现吸附平衡,最佳p H和温度均为6和28℃.在此环境条件下,Cu^(2+)最大吸附量分别为34.15和45.68 mg/g,可实现快速高效地去除废水中的重金属.

With the improvement of urban planning, surface processing industrial parks are continuous built in China.Due to its complex water quality and abundant existence of heavy metals, the traditional biological treatment unit exposed serious threaten from the existed heavy metals. Thus, the most common cation in electroplating wastewater,Cu^2＋, was chosen as object and the tolerant bacteria were isolated for enhancing its bulk removal. Two bacteria strains that have strong tolerance ability to Cu^2＋ were isolated and named as L2 and L3, and the effect of adsorption time, pH, temperature and initial concentration on Cu^2＋ removal were investigated. Results showed L2 and L3 have a high Cu^2＋ activity both in LB medium and wastewater medium, and the adsorption of Cu^2＋ could be achieved in a short time, with an optimal pH of 6. 0 and temperature of 28 ℃, respectively. Under the optimal condition, the maximum adsorption ability was 34.15 mg/g Cu^2＋for L2 and 45.68 mg/g for L3. A fast and efficient removal of Cu2＋ can be realized, which is anticipated to be used in the actual electroplating wastewater treatment.