基于显微操作的高效细胞电融合芯片的设计

Design of an Efficient Cell Electrofusion Chip Based on Micromanipulation

设计了一款基于显微操作的高效细胞电融合芯片,并针对该电融合芯片提出了一种快速、准确、灵活的细胞配对融合操作方法。芯片使用ITO玻璃作为基底,在ITO上覆盖一层2μm厚的正光刻胶,并利用光刻加工技术在光刻胶上加工出直径25μm的微孔电极。设计了不同电极间距的微孔电极阵列,与钨针电极构成电融合电极对进行了细胞电融合实验。结果表明,电极间距为10mm的微孔电极阵列能够实现高效的细胞配对,在间距为0.5mm的微孔电极阵列上未观测到细胞吸附现象。

An efficient cell electrofusion chip based on micromanipulation was designed.A fast,accurate and flexible cell pairing method was developed for this electrofusion chip.The chip prototype was fabricated on an indium tin oxide（ITO）substrate that was subsequently covered by apositive photoresist film with the thickness of 2μm.Micropore electrodes measuring 25μm in diameter were fabricated on the film by lithography.Micropore electrode arrays with different spacings were manufactured and paired with tungsten needle for cell electrofusion experiment.Results showed that micropore electrode array with a 10 mm spacing could pair the cell efficiently,however cells align on the micropore electrode array with 0.5mm spacing was not observed.