摘要
对电子封装用硅铝合金焊接材料的裂纹产生机理进行简要的分析。针对其焊接后极易开裂的现象,通过对硅铝合金的激光焊接工艺参数和焊接结构进行优化,获得漏率R_1小于5×10^(-9) Pa·m^3/s(He)的封装器件。气密性成品率高于95%,且通过按GJB548B-2005方法 1010.1条件B的100次温循等可靠性试验。
By analyzing the crack formation mechanism of laser welding aluminum-silicon alloy in electric packaging field, the paper optimizes the welding parameters and structureand obtains packages with the yield of hermetic higher than 95% and the leakage rate less than 5×10^-9Pa·m^3/s. The packages obtained also pass the high-reliable tests including 100 times temperature cycle in the condition B of method 1010.1 according to GJB548B-2005.
出处
《电子与封装》
2016年第8期1-4,共4页
Electronics & Packaging
关键词
硅铝合金
气密封装
激光焊接
silumin alloys
hermetic package
laser welding
