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一种曲率补偿的高精度带隙基准源设计 被引量:4

Design of a Bandgap Reference with Curvature Compensation
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摘要 基于CSMC 0.5μm CMOS工艺,设计了一种带曲率补偿的低温漂带隙基准源。采用折叠式共源共栅放大器反馈结构带隙基准源,利用晶体管的VBE与IC的温度特性产生T1n T补偿量,对传统的带隙基准进行曲率补偿。仿真结果表明,在5 V供电电压下,-40~125℃温度范围内,基准电压的波动范围为1.2715~1.2720 V,温漂为3.0×10^(-6)/℃,低频时电路电源抑制比为-86 d B。 The paper proposes a design of a low temperature drift bandgap reference with curvature compensation in CSMC 0.5 μm CMOS process. The circuit adopts conventional bandgap voltage source with folded-cascode amplifier-feedback architecture and generates a T1 n T compensation for conventional bandgap reference. Simulation results show that under the power supply voltage of 5 V and temperature range of-40 ℃to 125 ℃,the output reference voltage is of the range from 1.2715 V to 1.2720 V with a temperature coefficient about 3.0×10^(-6)/℃ and a low frequency power supply rejection ratio of-86 d B.
机构地区 中国兵器工业第
出处 《电子与封装》 2016年第8期34-36,40,共4页 Electronics & Packaging
关键词 曲率补偿 带隙基准 折叠式共源共栅 curvature compensation bandgap reference folded-cascode
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  • 1张红南,曾健平,田涛.分段线性补偿型CMOS带隙基准电压源设计[J].计测技术,2006,26(1):35-38. 被引量:4
  • 2Razavi,B.模拟CMOS集成电路设计[M].陈贵灿译.西安:西安交通大学出版社,2002.458-462.
  • 3Song B S , Gray P R. A precision curvature-compensa- ted CMOS bandgap reference [J]. IEEE J Solid-State Circuits, 1983(18) : 634-643.
  • 4Rincon-Mora G A , Allen P E. A 1.1-V current-mode and piecewise-linear curvature-corrected bandgap refer- ence [J]. IEEE J Solid-State Circuits, 1998(33) : 1551 -1554.
  • 5Ka Nang Leung, Philip K T Mok, Chi Yat Leung. A2- V 23-μ 5.3-ppm/C Curvature-compensated CMOS Bandgap Voltage Reference[J]. IEEE Journal of Solid- state Circuits, 2003,38(3).
  • 6Lee I, Kim G, Kim W. Exponential curvature-com- pensated BiCMOS bandgap references [J] . IEEE J. Solid-State Circuits, 1994(29) :1396-1403.
  • 7Rajarshi Paul, Amit Patra, Shailendra Baranwal , et al Design of second-order sub-bandgap mixed-mode volt- age reference circuit for low voltage applications [C]// proceedings of the 18th International Conference on VLSI Design held jointly with 4th International Con- ference on Embedded Systems Design washington, DC. USA : IEEE , 2005 : 307-312.
  • 8Johns D A , Martin K . Analog integrated circuit de- sign [M]. NewYork: Wiley, 1997.
  • 9Rincon-Mora G A, Voltage references-from diodes to precision high-Order bandgap cireuits [M]. New York: Wiley, 2002.
  • 10W C Dillard , Jaegr R C. The temperature dependence of the amplification factor of bipolar-junction tran- sistors [J] . IEEE Trans Devices, 1987(34) 1139-142.

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