期刊文献+

基于预采样的模块级热分析方法

PS-BloTAM:Pre-Sampling Based Block Level Temperature Analysis Methodology
下载PDF
导出
摘要 对片上多核系统(MPSoC)进行高效结构级热分析是进行温敏布图规划与实时功耗温度管理研究的关键.由于需要预先使用HotSpot提取布图规划中功能模块之间的相关热阻参数,最新的结构级热分析算法BloTAM在温敏布图规划中的热分析效率并不理想.对于散热条件与内核尺寸确定的温敏布图规划,该文提出了一种预采样的结构级热分析算法PS-BloTAM,它先使用HotSpot为采样模块阵列建立相关热阻预采样矩阵S(即相关热阻库),温敏布图规划产生一个方案后,PS-BloTAM可以根据方案中模块的大小与位置直接使用S计算出模块之间的相关热阻矩阵R,然后使用R计算出不同工作模式下的模块温度.采用传统的设计库思想,PS-BloTAM能够快速计算出不同布图规划方案所产生的热点温度.实验数据表明:(1)与HotSpot相比,PS-BloTAM的平均误差与最大误差分别小于1.65%和6.64%,可以获得43倍的加速效果;(2)与BloTAM相比,PS-BloTAM可以获得3.4倍的加速效果;(3)在温敏布图规划的应用中,PS-BloTAM以小于1.24%误差的代价、获得了比HotSpot快近10倍的加速效果. Efficient thermal analysis (TA) plays a key role in the temperature-aware floorplanning design and Dynamic Power and Temperature Management (DPTM) for Multi-Processor System- on-Chip (MPSoC). Due to the prerequisite of using HotSpot, a commercial TA tool, to extract the thermal resistance matrix, the latest architecture-level TA method BloTAM is inefficient to analyze temperature distributions for numerous floorplanning solutions. For temperature-aware floorplanning with defined die geometric size and unchanged heat dissipation system, this paper proposes a novel pre-sampling BloTAM, e. g. PS-BloTAM. This method first adopts HotSpot to build Sj the sampling thermal resistance matrix for sampling block arrays. Then according to size and position of modules in a given floorplanning solution, PS-BloTAM analytically computes the thermal resistance matrix R with S. Finally with the method can analytically compute temperature distributions for modules in different working modes. Adopting traditional idea of design library, PS-BloTAM is able to quickly give user temperature distributions of numerous floorplans. Experiments show that: (1) Comparing to HotSpot, PS-BloTAM can achieve 43X speedup with average error and maximum error less than 1.65% and 6.64%, what’ s more, it can provide speedup as high as 43 times; (2 ) Comparing to BloTAM, PS-BloTAM can provide speedup as high as 3. 4 times; (3) In temperature floorplanning, PS-BloTAM can provide nearly ten times speedup over HotSpot with the slight accuracy penalty of less than 1. 24% errors.
出处 《计算机学报》 EI CSCD 北大核心 2016年第9期1900-1911,共12页 Chinese Journal of Computers
基金 国家自然科学基金(61274033 61271198 61171014) 中央高校基本科研业务费专项资金资助
关键词 多核片上系统 结构级 热分析 建模 布图规划 MPSoC block level thermal analysis modelling temperature-aware floorplanning
  • 相关文献

参考文献15

  • 1Huang W- Stan M R, Sankaranarayanan K , et al. Many-coredesign from a thermal perspectiye//Proceedings of the DAC2008. New York, U SA , 2008: 746-749.
  • 2Ilealy M B, Lee II II S , Loh G II. Thermal optimization inmulti-granularity multi-core floorplanning//Proceedings of theASP-DAC 2009. Yokohama, Japan, 2009: 43-48.
  • 3Michael K , Sherief R. Frequency and voltage planning formulti-core processors under thermal constraints//Proceedingsof the ICCD 2008. Los Alamitos, U SA, 2008; 463-470.
  • 4Sankaranarayanan K , Meyer B II, Stan M R , et al. Thermalbenefit of multi-core floorplanning: A limits study. SustainableComputing, Informatics and Systems, 2 0 11, 1(4 ) : 286-293.
  • 5Ilanumaiah V , Rao R , Vrudhula S , et al. Throughputoptimal task allocation under thermal constraints for multicoreprocessors//Proceedings of the DAC 2009. San Francisco,U SA , 2009: 776-781.
  • 6Ge Y , Qiu Q R. Task allocation for minimum system powerin a homogenous multi-core processor//Proceedings of theInternational Green Computing Conference 2010. Los Alamitos,U SA , 2 0 10: 299-306.
  • 7Lung C L , Ho Y L, Kwai D M, et al. Thermal-aware onlinetask allocation lor 3D multi-core processor throughput optimization//Proceedings of the DATE 2011. New York,U SA , 2 0 1 1: 1-6.
  • 8Huang W - Ghosh S, Yelusamy S, et al. IlotSpot: A compactthermal modeling methodology for early-stage VLSI design.IEEE Transactions on Very Large Scale Integration (VLSI)Systems. 2006, 14 (5) : 501-513.
  • 9Juan D C, Marculescu D. A learning-based autoregressivemodel for fast transient thermal analysis of chip-multiprocessors//Proceedings of the ASP-DAC 2012. Piscataway, U SA,2 0 12: 597-602.
  • 10Sarangi S R , Ananthanarayanan G , Balakrishnan M. LightSim:A leakage aware ultra fast temperature simulator//Proceedingsof the IEEE/ACM ASP-DAC. Piscataway, U SA , 2 0 14:855-860.

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部