表面组装技术

Surface Mounting Technology

表面组装技术是将传统的分立式电子器件压缩成体积很小的无引线或短引线片状器件,直接贴装在印制板铜箔上,从而实现电子产品组装的高密度、高可靠性、小型化、低成本以及生产的自动化。随着电子技术和通信技术的发展,电子产品的体积越来越小,要求电子元器件的尺寸规格也越来越小,使得传统的电子产品焊接已不能满足需求,表面组装技术应运而生,对表面组装工艺的掌握直接影响到电子产品的焊接水平,也直接影响到电子产品的性能和质量,并且随着SMT的快速发展和普及,其工艺技术日趋成熟,并已经规范化。

Surface mounting, as a technology for compressing the traditional discrete type electroniccomponent into a small size of non lead or short lead sheet device directly to mount on the printed copperplate, can be used to realize the electronic products assembly of high density, high reliability,miniaturization, low cost and production automation. With the rapid development of electronic technologyand communication technology, more and more electronic products with small volume, size specificationsof the smaller electronic components is required as well, and the surface mounting technology is popularbecause the traditional welding can not meet the requirement for the electronic products. The control ofsurface assembly process directly affects the welding level, the performance and quality of electronicproducts. With the rapid development and popularization of mounting technology SMT surface, it becomesmore and more mature and standardized.