荧光粉封装方式对多芯片阵列LED封装效率的影响

Effect of Different Packaging of Phosphor on the Encapsulation Efficiency of Multi-chips LED

针对荧光粉封装的多芯片LED,用Monte Carlo光线追迹的方法仿真光线在蓝光芯片和荧光粉中的传播,并分析了荧光粉封装方式对多芯片阵列LED封装效率的影响.结果表明:随着荧光粉层和芯片之间的距离增大,保型涂覆的LED封装效率先增加后减小,最大封装效率为59%;平面涂覆的LED在芯片间距为0.2mm、荧光粉层和芯片之间的距离为0.28mm时,封装效率为77.183%;荧光粉层的曲率半径对封装效率的影响较小.

For the multi-chips LED packaged by phosphor layers, the light propagation in blue chip and phosphor layer was simulated based on the mathod of Monte Carlo. The influence of the encapsulation efficiency on different distrances between chip and phosphor layer was analyzed. The result shows that, the encapsulation efficiency of conformal coating firstly rises, then drops with the increasing of the diameter. The flat remote coating has a higher efficiency compared with others. The maximum encapsulation efficiency reaches up to 77.183% for the flat remote coating while the gap of chips is set as 0.2 mm and the distance between chip and phosphor layer is 0.28 mm. The influence of the curvature radius of phosphor layer on encapsulation efficiency is small.