振动辅助抛光的原理分析与实验研究

Principle Analysis and Experimental Study of Vibration Assisted Polishing

首先从理论上分析了振动辅助抛光的加工过程,通过建立单颗磨粒冲击工件的数学模型,分析了振动参数变化引起硬脆材料的塑-脆去除方式转变机制。采用LY-DYNA软件对球形和锥形磨粒冲击工件的仿真分析结果表明:随着振动参数的增强,磨粒切入深度增加,达到临界切削深度后产生裂纹脆性去除,从而能够实现工件材料的额外去除。在实验平台上开展的径向振动抛光实验结果表明:引入振动后抛光去除效率显著提升,证明了理论分析的正确性。

The theoretical analysis of vibration assisted polishing process was carried out. Through establishing mathematical model of the single abrasive grain impacting workpiece, the ductile-brittle transition mechanism of hard- brittle materials caused by vibration parameter changes was analyzed. LY-DYNA simulation is used to analyze the process of spherical and conical abrasive particles impacting workpiece. The results showed that the depth of processing got higher with the enhancement of vibration signal, when the critical cutting depth was reached, crack was generated in order to achieve additional workpiece material removal under brittle removal. The radial vibration polishing experiment was carried out. The results showed that material removal efficiency was promoted consistent with the theoretical analysis.