摘要
The mechanical failure of solid oxide fuel cell(SOFC) components may cause cracks with consequences such as gas leakage,structure instability and reduction of cell lifetime.A comprehensive 3D model of the thermal stresses of an anode-supported planar SOFC is presented in this work.The main objective of this paper is to get an interconnect optimized design by evaluating the thermal stresses of an anode-supported SOFC for different designs,which would be a new criterion for interconnect design.The model incorporates the momentum,mass,heat,ion and electron transport,as well as steady-state mechanics.Heat from methane steam reforming and water-gas shift reaction were considered in our model.The results examine the relationship between the interconnect structures and thermal stresses in SOFC at certain mechanical properties.A wider interconnect of the anode side lowers the stress obviously.The simulation results also indicate that thermal stress of coflow design is smaller than that of counterflow,corresponding to the temperature distribution.This study shows that it is possible to design interconnects for an optimum thermal stress performance of the cell.
The mechanical failure of solid oxide fuel cell （SOFC） components may cause cracks with consequences such as gas leakage, structure instability and reduction of cell lifetime. A comprehensive 3D model of the thermal stresses of an anode-supported planar SOFC is presented in this work. The main objective of this paper is to get an interconnect optimized design by evaluating the thermal stresses of an anode-supported SOFC for different designs, which would be a new criterion for interconnect design. The model incorporates the momentum, mass, heat, ion and electron transport, as well as steady-state mechanics. Heat from methane steam reforming and water-gas shift reac- tion were considered in our model. The results examine the relationship between the interconnect structures and ther- mal stresses in SOFC at certain mechanical properties. A wider interconnect of the anode side lowers the stress obviously. The simulation results also indicate that thermal stress of coflow design is smaller than that of counterflow, corresponding to the temperature distribution. This study shows that it is possible to design interconnects for an optimum thermal stress performance of the cell.
基金
financially supported by the Research Fund for International Young Scientists(51550110238)
the Fundamental Research Funds for the Central Universities (ZYGX2015J108)
