近十年中国无铅钎料研究进展

Development of lead-free solders in China during the past decade

针对近十年中国研究者关于新型无铅钎料研究问题,评述了无铅钎料的研究进展及发展趋势.首先分析了不同无铅钎料的特性,探讨合金化、颗粒强化以及纳米化在新型无铅钎料研究中的作用.其次探讨无铅钎料辅助钎剂的作用以及新型钎剂的研究进展.再次阐述了无铅钎料的在电子工业中的应用情况,探讨其可靠性.最后针对无铅钎料的未来发展进行展望,分析其研究与应用过程中存在的问题及解决办法,为新型无铅钎料的进一步研究提供理论支撑.

For the new lead-free solders research in China during the past decade, the research status and development trend of lead-free solders were reviewed synthetically. First of all, it is imperative to discuss the behaviors of different lead-free solder, and the effect of alloying, particles strength and nanominiaturization on lead-free solders. Secondly, the fluxes for lead-free solders were also reviewed and the research development of new flux was discussed. Thirdly, the applications of lead-free solders in electronic industry were remarked, and the related reliability issues were discussed. Lastly the future progress of lead-free solders was prospected, the issues of the lead-free solders were analyzed and some measures were shown for solving these problems, which can provide the theoretical reference for the lead-free solders.