CMP抛光界面温度的在线检测

The On-line Detection of Polishing Interface Temperature in CMP

介绍了化学机械抛光过程中监控抛光界面温度的重要性。总结了其他学者对抛光界面温度的检测方法,并分析每种方法的优缺点。设计了一种抛光界面温度在线检测装置,介绍了它的结构和组成该装置的各元件型号及性能。进行了不同抛光压力、抛光盘转速和抛光液流量的CMP试验,并利用该装置检测各情况下的抛光界面温度变化。为了进一步地说明该装置的有效性,将抛光液流量为20m L/min时的温度检测结果与仿真结果对比,六组对比数据都十分接近,同时也验证了该计算方法的有效性。提出了将该温度检测装置应用于判断抛光过程是否正常以及某些工件的抛光终点检测的想法。

The importance of monitoring the temperature on the polishing interface in the process of chemical mechanical polishing was introduced. The detection methods for polishing interface temperature of other scholars were summarized,and the advantages and disadvantages of each method were analyzed. Thus we designed an on-line polishing interface temperature detection device,and introduced its structure and the model and performance of the various components that form the device. The CMP experiments of different polishing pressure,polishing plate rotational speed and polishing slurry flowrate were carried out,and the device was used to detect the change of temperature at the same time. In order to further illustrate the effectiveness of the proposed device,the test results of the polishing slurry flowrate for 20 m L / min was compared with the simulation results,and the six groups of comparative data were very close,which also verified the validity of the calculation method. Applying the temperature detection device to determining whether the polishing process is normal and detecting the polishing end point of some workpieces was proposed in this paper.