高多层PCB用无卤高耐热覆铜板的制备及其性能研究

Study of halogen free, high heat resistance copper clad laminate for high-multilayer PCB

文章采用含磷酚醛(PN-P)、含氮酚醛(PN-N)和线性苯酚酚醛(PN)所组成的复合固化剂固化双马来酰亚胺(BMI)/环氧树脂(EP)体系,对体系的反应性和工艺性进行了系统的表征,得到了一种综合性能优异的无卤阻燃覆铜板。结果表明,所研制的覆铜板具有优异的耐热性、介电性能和加工性,很好地满足了高多层PCB对CCL的需求,具有广阔的应用前景。

In this paper, the PN-P/PN-N/PN were used as compound curing agent of bismaleimide/Epoxy resin system, the curing reaction and process property were discussed, and a novel halogen free flame retardant laminate with high comprehensive performance was developed. Results show that the Copper Clad Laminate developed by us has outstanding heat resistance, excellent dielectric properties and good process property. It well meets the dernands for high-multilayer PCB and has a broad application prospect.