加工多类型晶圆的集束型装备调度模型

Scheduling Model of Cluster Tools for Concurrent Processing of Multiple Wafer Types

研究了加工多类型晶圆和有滞留时间约束的集束型装备调度问题,其中包括晶圆排序和双臂机械手搬运作业排序两类问题.分别推导了三类不等式约束条件,包括加工模块处于加工和空闲两种状态下的滞留时间约束、任意单个和两个搬运作业情况下的机械手搬运能力约束,以及加工模块能力约束,建立了以最小化生产周期为目标的混合整数规划模型.典型生产实例和随机算例的仿真结果验证了模型的可行性和有效性.

The scheduling problem of cluster tools with concurrent processing of multiple wafer types and residency time constraints is addressed. The problem consists of two types of sequencing issues： wafer input sequencing and robot action sequencing. Three kinds of inequality constraints, including residency time constraints when processing module is either empty or occupied, robots capacity constraints in the condition of any single move and two consecutive moves, and capacity constraints of processing module, are deduced respectively. A mixed integer programming model with object of minimized cycle time is constructed. At last, the simulation results from typical production instances and random examples show the feasibility and effectiveness of the proposed model.