摘要
加入无机填料是降低胶黏剂和复合材料热膨胀的常用方法,以环氧树脂/芳香胺固化体系为基体,分别以表面处理后的氧化铝(Al2O3)、氮化硼(BN)、二氧化硅(Si O2)作为填料,制备了含不同质量分数填料的环氧树脂基复合材料。采用TMA、DMA等手段对复合材料的性能进行了分析,探讨了填料的种类和含量等因素对于复合材料热膨胀行为和玻璃化转变温度的影响。研究表明,随着填料的增加玻璃化转变温度向高温区移动,内耗整体上呈现下降趋势。
It is a commonly used method to reduce thermal expansion of epoxy resin by adding inorganic fillers. In this paper, the epoxy/aromatic amine curing system was prepared with different amount of Al2O3, BN and SiO2 which were after surface treatment. The properties of composites were analyzed by means of TMA and DMA methods and the effect of type and amount of filler on the thermal expansion behavior and glass transition temperature （Tg） was discussed. It was found that the Tg would rise with the increasing amount of filler, while the tan δ would decline.
出处
《化学与粘合》
CAS
2016年第5期336-339,共4页
Chemistry and Adhesion
关键词
环氧树脂
无机填料
热膨胀行为
Epoxy
inorganic fillers
thermal expansion behavior
