基于平面估计的三维测量相位展开新方法

PMP Phase Unwrapping New Method Based on Plain Estimation

工业自动化生产中微米级的三维测量大多采用相位测量轮廓术,但其中现有的包裹相位展开方法容易受图像噪声和相位突变的干扰;在电路板贴片安装的锡膏三维测量中,利用电路板的平面区域包裹相位信息进行平面估计,然后全局相位展开向拟合平面靠拢,根据统计信息确定参数,得到连续相位;利用展开后的相位再进行电路板平面的二次曲面拟合,提高基平面的拟合精度和相对高度;对比实验证明了该方法的鲁棒性和快速性,处理时间短,不受噪声、相位突变、阴影等干扰。

Phase measurement profilometry basedμm size 3Dinspection was widely used in automation manufacturing line.However,conventional phase unwrapping for the inspection suffered from image noise or phase break.In electronic PCB SMT assembly line,considering plain area segmented from 2Dimage,a new phase unwrapping method was proposed that wrapped phases can be shift close to plain estimated from the PCB plain area and quadric fitting was taken from unwrapped phases for base plain under the measured object.Contrast experimental results show the method effectively improved performance in robust,speed and anti-interference of noise,break and shadow.