新型铜粉导电复合物的合成

Synthesis of A New Conductive Copper Powder Composite

以Bi_2O_3与Sn(OH)_4为原料、NaBH_4为还原剂,成功在3.5μm球形铜粉表面包覆了Sn-Bi合金层,将铜粉与高分子基体(聚乙烯吡咯烷酮、丙烯酸树脂、环氧树脂)复合制备了导电复合物。采用场发射扫描电镜(SEM)、能谱仪(EDS)与差示扫描量热仪(DSC)表征包覆铜粉的组成与结构,采用刮板细度计测试复合物的分散与稳定性能,并用万用电表测试其导电性能。结果表明,包覆铜粉复合物的导电性能较纯铜粉复合物明显提高。

3.5 μm spherical copper powders coated with Sn-Bi alloy were synthesized using Bi2O3 and Sn（OH）4 as raw materials and NaBH4 as reductant.Then,copper powders and polymer matrixes （polyvinyl pyrrolidone,acrylic resins,epoxy） were blended to prepare conductive composites.The composition and structure of coated copper powders were characterized by Scanning Electron Microscopy （SEM）,Energy Dispersive Spectroscopy （EDS） and Differential Scanning Calorimetry （DSC）.The dispersion and stability properties of the composites were characterized by fineness gauge,and electric conductivity of composites was also investigated by multimeter.Results show that the coated copper powder composites possess much stronger conductive capability than the pure copper powder composites.