镍基高温合金TLP扩散焊中间层材料研究进展

Research progress of interlayer alloys for transient liquid phase( TLP) diffusion bonding of Ni-based superalloys

针对镍基高温合金瞬时液相扩散焊,阐述了中间层材料的选择原则,并分类阐述了直接使用标准镍钎料和以母材成分为基的中间层材料研究现状。指出标准镍钎料的中间层材料受成分和焊接温度的限制,接头质量无法满足热端结构件的使用要求,而以母材成分为基的非晶箔状中间层材料可以得到同母材成分和组织均匀一致的接头,将在镍基高温合金瞬时液相扩散焊中得到更为广泛的应用。

The composition design principles of interlayer alloys employed for TLP diffusion bonding of Ni-based superalloys were introduced.The current research status of interlayer alloys,which were classified as standard Ni-based filler metals and ones based on the substrates,were elaborated,respectively. Although the former are still the most commonly used interlayer alloys at present,it generally failed to achieve joints with desirable performances to satisfy the ever increasing requirement for hot section components due to the limited compositions and bonding temperature. However,the amorphous interlayers made of the base metal can attain the joints with comparable composition and microstructure to those of the substrates,which will be more widely used in the future.