基于贪心算法的3D-Mesh片上网络层间互联结构

Network on Chip Inter-layer Connection Structure for 3D-Mesh Based on Greedy Algorithm

为改善3D-Mesh拓扑结构层间互联结构固定,难以应对网络流量变化的现状,提出一种基于贪心算法的自适应3D-Mesh层间互联结构。通过对网络参数进行实时测量,动态改变网络中硅通孔(TSV)的工作状态,使其自适应转变为最适合当前网络通信的路由器-TSV映射关系。实验结果表明,与全连接和部分连接3D-Mesh结构相比,该结构的网络资源分配更合理,且具有较高的网络吞吐量及较低的延时。

To improve the 3D-Mesh topology inter-layer structure which is hard to deal with network traffic changing, an adaptive inter-layer structure for 3D-Mesh based on greedy algorithm is proposed. It measures network parameters in real-time,dynamically changes Through Silicon Via （TSV） working conditions, and adaptively transforms the most appropriate router-TSV mappings for current network. Experimental results show that compared with full accessed and partially accessed 3D-Mesh, this inter-layer structure is more reasonable in allocation of network resources, and it improves throughput and reduces latency.