摘要
通过对Ru-V合金粉末钎料选择与制备,焊接工艺性能试验及在1000-1200℃真空条件下阴极焊接件的蒸发试验等研究,结果表明,所选的Ru-V合金钎料满足了真空电子器件阴极的焊接温度要求;Ru-V合金球形粉末在母材W,Mo上的润湿、铺展性能非常好,能完全润湿母材;阴极W/Mo焊接件在1000-1200℃的真空条件下无蒸发物出现,满足了生产工艺要求。
The selection and preparation of the ruthenium-vanadium alloy solder powder,welding technology tests and cathode weldment's evaporation experiments in vacuum condiction at 1000 - 1200 ℃,etc.,were studied. The results showed that the selected ruthenium-vanadium superalloy met the brazing temperature requirements of vacuum electronic devices. This spherical powder solder of ruthenium- vanadium alloy was completely wetting, the wettability and spreadability were very good on base metal W and Mo. Cathode W / Mo welding pieces had any evaporation in vacuum condition at 1000 - 1200 ℃,met the requirements of the production process.
出处
《广州化工》
CAS
2016年第17期112-114,共3页
GuangZhou Chemical Industry
关键词
Ru-V合金
钎料
焊接性
阴极
ruthenium-vanadium alloy
brazing
weldability
cathode