光电子器件封装中微位移传感器的设计与仿真

Design and simulation of optoelectronic devices package micro-displacement sensor

在光电子器件封装中,光纤组件和阵列波导芯片之间微小位移的检测对封装效率有很大的影响。分析了目前光电子封装存在的问题,并对几种位移测量方法进行了比较,提出了基于电阻应变式一维位移传感器结构。首先,对位移传感器结构进行了理论上的分析,得到了微位移与应变的关系式;然后,采用ANSYS有限元分析软件对传感器的结构的进行仿真分析,得到位移与应变之间的仿真值;最后,把理论上的分析值与仿真得到的结果进行比较分析。结果表明,新型传感器能够检测微米级位移,通过优化弹性薄片的结构和改变施力点的位置,可以有效的提高传感器的灵敏度。

In the optoelectronic device package,small displacement detection has a great influence on the packaging efficiency between the optical fiber array waveguide components and chips.It analyzes the existing problems optoelectronic packaging,and several displacement measurement methods are compared,proposed a one-dimensional displacement resistance strain sensor structure.First,this thesis conclude the equation of micro-displacement and strain using methodology of analyzing the structure of sensor.Then,in this paper demonstrate the process of simulating micro-displacement and strain of sensor,using ANSYS as simulation tool.Finally,the results of theoretical analysis and simulation values obtained were compared.The simulation shows that the novel sensor is capable of detecting micron displacement and has high sensitivity.And bettering the structure of the Elastic slice and adjusting the action spots are viable and valid methods to enhance the sensitivity of sensor.