金刚石飞切加工参数对单晶硅的脆—塑转变影响

Study on Influence of Diamond Fly Cutting Parameter on Brittle Plastic Transition Based on Single Crystal Silicon

针对切削深度、进给量、主轴转速三个因素制定了单因素试验方案,并进行了单晶硅片的金刚石飞切加工试验。通过对试验结果的电镜检测,得出了各因素对加工机理的影响规律。

Based on the single factor experiment of three factors,the culting depth,feed rate and the rotational speed of the spindle,the experiment of diamond cutting with single crystal silicon is carried out. By means of electron microscope examination of the experimental results,the influences of various factors on the processing mechanism are obtained.