基于再流焊技术的导通镀覆孔透锡工艺研究

Research of Via Tin-process based on Reflow Soldering Technology

针对印制线路板潜在的铜镀层不连续或铜镀层空洞现象,研究了基于再流焊技术的导通镀覆孔透锡工艺及实现流程。经工艺试验验证,取得了良好的效果,并具有一致性好、可靠性高等优点,为某些高可靠性产品需求提供了实用价值较高的借鉴经验。

Based on reflow soldering technology, describe the process and realize the procedure of via tin-process. Finally, through the experimental test and process validation, the results indicate that the research has advantage over traditional methods in consistency and reliability. It is often applied to some high-reliability products according to the practical situation.