嵌入式低温共固化高阻尼纤维/树脂基复合材料

Embedded low-temperature co-curing high damping fiber/resin matrix composites

通过正交试验新研制出一种可以与玻璃纤维/BA9913环氧树脂预浸料低温共固化的高阻尼黏弹性材料,提出使用四氢呋喃(THF)作为溶剂,将该高阻尼材料制成黏弹性材料溶液。采用双面刷涂工艺,将玻璃纤维/BA9913环氧树脂复合材料制成带阻尼薄膜的预浸料,按照设计的铺层根据热压罐固化工艺制成嵌入式低温共固化高阻尼复合材料试件。模态试验和层间剪切试验验证了本文所提出制作工艺和黏弹性材料组分的有效性,试件一阶模态损耗因子可达7.2%。为嵌入式低温共固化高阻尼复合材料的广泛使用奠定了基础。

A new kind of high damping viscoelastic material which can co-cure with glass fiber/BA9913 epoxy resin prepreg in low-temperature was investigated by the orthogonal test.After the high damping material was dissolved in tetrahydrofuran（THF）dissolvant to form viscoelastic material solution.The double-side brush coating process was developed to make the glass fiber/BA9913 epoxy resin composites into prepreg with damping membrane.According to the design layer,the embedded low-temperature co-curing high damping composite specimens were manufactured on the basis of autoclave curing process.The modal tests and interlaminar shear tests were used to verify the validity of the processing technology and viscoelastic material ingredient presented in this paper.The first order modal loss factor of specimen is up to 7.2%.The conclusions lay the foundation for the wide application of embedded low-temperature co-curing high damping composites.