透明LED石墨烯/苯基硅橡胶复合封装材料

Transparent graphene/phenyl-silicone rubber composites for LED packaging materials

采用化学接枝技术,利用硅烷偶联剂γ-氨丙基三乙氧基硅烷(KH-550)、水合肼改性氧化石墨烯(GO)制备功能型石墨烯(FG)。将FG与苯基硅橡胶混合,采用氢化硅烷化法,在铂催化剂作用下制备了一种发光二极管(LED)封装用FG/苯基硅橡胶复合材料,考察了改性后FG结构、表面官能团变化以及其用量对FG/苯基硅橡胶复合材料力学性能及光学性能的影响,并分析了FG/苯基硅橡胶复合材料的微观相态及其热稳定性。结果表明:经KH-550改性后的FG表面附有特殊官能团,能提高其在苯基硅橡胶中的分散性。当苯基硅橡胶中引入0.010 0wt%FG时,FG/苯基硅橡胶复合封装材料的透光率仍可达到85%以上,耐紫外老化性能和力学性有明显提高。FG/苯基硅橡胶复合材料的热分解温度为690℃、GO/苯基硅橡胶复合材料的热分解温度为623℃,而纯苯基硅橡胶的热分解温度为491℃,且FG/苯基硅橡胶复合材料的放热量始终比纯苯基硅橡胶略低。苯基硅橡胶中引入0.010 0wt%改性的FG,材料热分解温度提高了200℃,放热量有所减少,能更好满足功能型LED复合封装材料热稳定性能要求。

Graphene oxide（GO）was modified by silane coupling agent 3-triethoxysilyl-1-propanamine（KH-550）and hydrazine hydrate with chemical grafting technology,and functionalized graphene（FG）was prepared.Lightemitting diode（LED）packaged FG/phenyl-silicone rubber composites were synthesized by blending FG and phenylsilicone rubber through hydrogenated silane method under the effect of platinum catalyst.Effects of modified FG structure,variation of surface functional group and amount on mechanical properties and optical properties of FG/phenyl-silicone rubber composites were studied.Microscopic morphology and thermal stability of FG/phenyl-silicone rubber composites were analyzed.The results show that special functional group are attached on surface of FG modified by KH-550,which will improve the dispersion in phenyl-silicone rubber.Transmittance of FG/phenyl-silicone rubber composites can reach more than 85% by introducing 0.010 0wt% FG in phenyl-silicone rubber,ultraviolet aging resistance properties and mechanical properties were significantly improved.Thermal decomposition temperature of FG/phenyl-silicone rubber composites is 690 ℃,GO/phenyl-silicone rubber composites is 623 ℃,and pure phenyl-silicone rubber is 491 ℃.Heat release of FG/phenyl-silicone rubber composites is lower than that of pure phenyl-silicone rubber.By introducing 0.010 0wt% modified FG in phenyl-silicone rubber,the thermal decomposition temperature of materials will increase by 200℃ and heat release decreases which will meet the thermal stability requirements of functional LED composite packaging materials.