手持式干扰机的傅氏级数热布局优化

Thermal layout optimization of handheld jammer with Fourier series

针对手持式干扰机热布局的需要,利用傅里叶级数对影响热阻的因素进行优先级划分,通过芯片对热阻值影响的优先级依次对芯片进行布局,得到手持式干扰机电路板上芯片的最优布局方案。利用有限元分析软件ANSYS对最优布局方案进行仿真,结果表明,通过利用傅里叶级数对手持式干扰机电路板上的芯片进行优化布局,手持式干扰机的热阻值减小,散热变快。芯片的最高温度降低了4.75%,可靠性得到了提高。

According to the heat layout needs of the handheld jammer, the factors affecting on the thermal resistance are performed for priority division with Fourier series. The chips are successively placed according to the chips priority affecting on the thermal resistance to obtain the optimal layout scheme of the chips on the handhold jammer circuit board. The optimal layout scheme was simulated with the finite element analysis software ANSYS. The results show that the Fourier series used for optimal layout of the chips on the handheld jammer circuit board can reduce the thermal resistance of the handheld jammer and quicken the heat dissipation, the maximum temperature of the chip is reduced by 4.75%, and the reliability of the handheld jammer is improved.