氮化硼/聚合物导热复合材料研究进展

Research Progress on Boron Nitride/Polymer Thermally Conductive Composites

电子信息产业的高速发展,使得电子装置或装备在使用过程中产生的热量越来越剧烈,需要及时导出以保证其正常运行,聚合物基导热复合材料由于其优异的加工性和较低的成本得到了应用。六方氮化硼(hBN)兼具优异的导热性和绝缘性,因此作为导热填料在导热绝缘聚合物复合材料领域受到越来越多的关注。本文主要从氮化硼填料尺寸、表面性质、取向结构以及杂化等方面综述了近年来氮化硼/聚合物导热复合材料的研究进展。

With the rapid development of electronic industry, more heat is accumulated during the operating of the electric device or equipment. The heat should be removed timely to ensure the normal operation of the equipment. Polymerbased thermally conductive composites are widely used due to their easy processability and low cost. Hexagonal boron nitride （h-BN） possesses both outstanding thermal conductivity and electrical insulativity, and has attracted increasing attention in fabrication of thermally conductive and electrically insulating composites in recent years. The research progress of h-BN/polymer thermally conductive composites is reviewed in this article from the aspects of size, surface modification, orientation structure of h-BN and hybrid fillers.