摘要
剖析了多线切割的工作机理和硅片切割原理,对影响硅片翘曲度的设备关键部件进行理论分析,并通过切割试验来对分析的结果进行论证;同时,创建切割钢线的理想力学模型,利用偏微分方程对模型进行力学分析,分析出切割钢线工作时的振动特性,并进一步论证钢线振动诱发的加工特性对硅片翘曲度的影响。
In this paper, the mechanism of Multi-wire cutting and the principle of wafer cutting were analyzed, the theoretical analysis of key parts of the equipment affected the silicon-wafer warp was carded on, and through cutting test of analysis results were proved. At the same time, to create the ideal mechanical model of cutting steel wire, using the partial differential equations of the model for mechanical analysis, vibration characteristics of steel wire cutting were analyzed, and further demonstrates the processing characteristics of steel wire vibration induced silicon wafer warp age.
出处
《电子工业专用设备》
2016年第9期7-14,共8页
Equipment for Electronic Products Manufacturing
关键词
多线切割
硅片翘曲度
力学模型
振动特性
Multi-wire cutting
Silicon-wafer warp
Mechanical model
Vibration characteristics
