期刊文献+

气流悬浮输送技术的专利技术分析

Analysis on the Patent Technology of the Flow Air Suspension Conveying
下载PDF
导出
摘要 气流悬浮输送技术属于无接触输送方式中的一种,其通过气流作用于被输送物体,从而使物体与输送装置的表面无接触,相较于传统的输送技术,其具有摩擦系数低、不损伤被输送物体表面的优点。该技术经过长时间的发展和改进,目前已经广泛应用于各个自动化生产线领域,而且出现了基于多种原理的气流悬浮输送技术。本文从专利文献的角度出发,探讨了该技术在国内外的技术发展路线,并对各个技术分支的特点做了简要的概括说明,为相关领域的生产企业或者研究机构提供一定的参考。 The technology of the flow air suspension conveying is one kind of the non-contact conveying, in which the object is transported by air acting on its surface, so that the surface of the object has noncontact with the surface of the conveyor. Comparing with the traditional conveying technology, the technology of the flow air suspension conveying has a low coefficient of friction and does not damage the surface of the object. The technology has been developed and improved for a long time, it has been widely used in various areas of the automatic pipelines now. At the same time, a variety of technology of the flow air suspension conveying based on various principles comes out. From the per- spective of the patents, we discussed the developing route of the technology in China and foreign countries, and th^ characteristics of the various branches of the technology are briefly summarized to provide references for the company or research institutions in related fields.
出处 《河南科技》 2016年第14期85-88,共4页 Henan Science and Technology
关键词 气流 悬浮 无接触 输送 搬运 air suspension non-contact convey transport
  • 相关文献

参考文献4

二级参考文献33

  • 1门连通,白淑璠.非接触式搬运设备在液晶物流中的应用[J].物流技术,2006,25(5):27-29. 被引量:3
  • 2孙雅洲,卢泽生,饶河清.基于FLUENT软件的多孔质静压轴承静态特性的仿真与实验研究[J].机床与液压,2007,35(3):170-172. 被引量:21
  • 3罗清岳.非接触性大型玻璃基板搬运技术.国际光电与显示,2007,(6):61-63.
  • 4Kasuya Yosuke. The latest trends of semiconductor/FPD material handling system:daiichi institution Industry:Airsurfacing non-contact panel handling system [J]. Semicond. FPD World, 2006,25 (9) : 68-69 (in Japanese).
  • 5New Way Bearings Company. New Way Precision,Air Bearing Application Guide I-R]. Aston,USA:New Way Bearing Company, 2003.
  • 6第一设施設公業.LCD工場,半導體工場對応する基板サィズガ大きくなゐはど優位性が際立つ新型搬送技術[EB/OL].(株)テクノアソシェ一ツ.[2008-10-08].http://openlab-air.jp/articles/magicmove20060517.html.
  • 7崎野茂夫.基礎研究をぃかに実用製品に結ぴ付けたか加[J].Machine Design & Tribology,2002,(21):2.
  • 8Solar Research Laboratory Ltd. Bernoulli chuck for micro wafer chip[EB/OL]. [2008-10-08]. http://www, solarlab. co. jp/tipeng/tipeng_001, htm.
  • 9Li Xin, Kawashima Kenji, Kagawa Toshiharu. Modeling of non-contact handling device by using air swirling flow [C]//Proceeding of 6th EUROSIM Congress on Modelling and Simulation, Ljubljana, Slovenia: Slovejan Society for Modelling and Simulation SLOSIM and Ljubljana Faculty of Electrical Engineering,2007.
  • 10Advantages and challenges associated with the introduction of 450 mm wafers(2005)[DB/CD]. ITRS Starting Materials Sub-TWG, 2005.

共引文献13

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部