Al表面化学镀Ni-P合金及Al/Ni-P/Cu复合材料电性能的研究

Studies on electroless plating Ni-P alloy film on Al substrate and electrical property of Al/Ni-P/Cu composite

化学镀Ni-P合金中间层可提高Al材表面Cu镀覆性能。采用化学镀工艺,在Al表面沉积均匀连续的Ni-P合金层,再电镀Cu,形成Al/Ni-P/Cu复合材料。研究化学镀Ni-P合金层的表面形貌,成分及其成膜机理,以及Al/Ni-P/Cu复合材料的结构与电性能。结果表明,Al材经碱蚀前处理后,在其表面形成腐蚀坑或凸起,NiP合金在此位置优先沉积,逐渐成膜。碱性镀5min,酸性镀25min后,在Al材表面形成厚约5μm均匀致密的Ni-P合金镀层,再在其表面电镀140μm厚Cu层制备的Al/Cu复合材料的电阻率为2.92×10^(-8)Ω·m,经过150℃,360h热处理后,未发生Al、Cu相互扩散,复合材料的电阻率为3.04×10^(-8)Ω·m,结构与性能十分稳定。

Electrolessplating Ni-P alloy layer can enhance the plating ability of Cu on Al substrate.In this paper, a method for fabricating Al/Cu composite was introduced by electroless plating Ni-P alloy layer followed by e-lectroplating Cu.Planar and cross-sectional morphologies,compositions and formation mechanism of the elec-trolessplating Ni-P alloy layer and microstructure and electrical properties of the Al/Ni-P/Cu composite were investigated.The results show that Ni-P alloy particles are preferentially deposited on corrosion pits and em-bossments on Al surface,and gradually a continuous Ni-P alloy film was formed.A uniform and dense Ni-P al-loy layer of 5μm in thickness was deposited on Al substrate after electroless Ni-P alloy plated in the alkali solu-tion for 5 min and the in the acidic solution for 25 min.After electroplating a thick Cu layer of 140μm in thick-ness,the Al/Ni-P/Cu composite has an electrical resistivity of 2.92×10-8 Ω.m.After heat treated at 150 ℃for 360 h,interdiffusion between Al and Cu is not detected,and electrical resistivity of the Al/Ni-P/Cu com-posite is just 3.04×10-8 Ω.m,indicating that microstructure and electrical resistivity of the composite are ex-tremely steady.