溅射气压对磁控溅射Mo背电极层形貌与结构的影响

Influence of Working Pressure on Morphologies and Microstructures of Magnetron Sputtered Mo Back Electrode

采用直流磁控溅射法在溅射气压为0.1-1.0Pa下制备了金属Mo膜。用扫描电子显微镜（SEM）和原子力显微镜（AFM）对单层Mo膜的表面、断面形貌和粗糙度进行了分析与表征;用X射线衍射（XRD）研究了气压对Mo膜晶粒尺寸和薄膜应力应变的影响;用SEM观察了双层和三层Mo背电极层的表面形貌。结果表明,溅射气压升高,表面颗粒由细长变得圆润,均方根粗糙度升高,其值介于1.32-4.81nm之间;Mo膜的晶粒尺寸随气压的升高而降低,其值介于27.2-11.7nm之间;溅射气压为0.2Pa和0.3Pa时制备的Mo膜显现为张应力;将双层Mo背电极表面制备0.7Pa的Mo层后,表面更加圆润,孔隙增多。

Mo films were prepared by DC magnetron sputtering using various sputtering pressures ranging from0.1Pa to 1.0Pa.The plane（cross section morphologies,root mean square roughness（RMS）of the Mo films were characterized by scanning electron microscope（SEM）and atomic force microscope（AFM）.X-ray diffraction（XRD）was used to study the grain size and the stress of the films.The morphologies of Mo bilayer and trilayer back electrodes were also observed by SEM.The results revealed that slender particles became round and RMS increased from1.32 nm to 4.81 nm as sputtering pressure increasing.The grain size of the films decreased from 27.2nm to 11.7nm as the sputtering pressures increasing.Tensile stress appeared in films deposited under sputtering pressure of 0.2Pa and 0.3Pa.As Mo bilayer was covered with a Mo film deposited under a sputtering pressure of 0.7Pa,the surface became rounder and more voids appeared.