摘要
为了提高钛/不锈钢扩散连接接头性能,缩短连接时间,抑制界面反应产物的过度生长,本文采用50μm纯铜箔做中间层,进行脉冲加压扩散连接。通过扫描电镜观察、万能拉伸试验和XRD分析对钛/铜/不锈钢接头界面组织和力学性能进行了分析。结果表明,当连接时间为120 s时即可得到可靠的接头。在钛/铜界面生成了Ti2Cu、Ti Cu、Ti3Cu4和Ti Cu4等金属间化合物层,而在铜/不锈钢界面生成了Fe-Cu固溶体。在拉伸载荷下,试样沿钛/铜界面反应产物发生脆性断裂,接头强度达到了340 MPa。
To improve the performance of diffusion bonded Ti/stainless steel joint, shorten the bonding time, and control interfacial reaction product overgrowth, 50 μm copper foil was used as interlayer between Ti and stainless steel to carry out impulse pressure diffusion bonding. Then, the interfacial microstructure and the mechanical properties of impulse pressure diffusion bonded Ti/Cu/stainless steel joint were investigated by using scanning electron microscopy （SEM）, tensile tests and XRD analysis. Results reveal that reliable joint can be obtained when bonded for only 120 s. Intermetallic compound layers including Ti2Cu, TiCu, Ti3Cth and TiCu4 are generated at the Ti/Cu interface, whereas Fe-Cu solid solution is generated at the Cu/stainless steel interface. Under tensile loading, the joint fractures along the Ti/Cu interracial reaction layer in a brittle mode, and the maximum tensile strength of 340 MPa is achieved.
作者
王敬
王勇
WANG Jing WANG Yong(Chongqing Technology ＆ Business Institute, Chongqing 401520, China College of Material Science and Engineering, Chongqing University, Chongqing 400044, China Cbongqing College of Electronic Engineering, Chongqing 401331, China)
出处
《热加工工艺》
CSCD
北大核心
2016年第19期62-65,共4页
Hot Working Technology
基金
国家自然科学基金资助项目(51275543)
关键词
钛
不锈钢
扩散连接
显微组织
力学性能
titanium
stainless steel
diffusion bonding
microstructure
mechanical properties
